Specially Designed Thermal Testing & Cycling Equipment for Semiconductor Technology
AGNEW-ASSO proudly represents advanced thermal testing and cycling solutions tailored for semiconductor technology. Semiconductor components fall into two main categories: commercial grade and military grade. Commercial grade components are tested within temperature ranges of -40˚C to 85˚C, while military grade components require a stricter range of -55˚C to 125˚C in highly precise, moisture-free environments. AGNEW-ASSO connects manufacturers with testing units capable of meeting the requirements for both grades.
The semiconductor testing solutions we represent include thermal air forcing systems that directly apply specific temperatures to semiconductors for performance testing. These systems streamline the temperature cycling process and enhance production performance across industries.
When precision in electronic and materials testing is critical, AGNEW-ASSO offers access to compact environmental test chambers designed for semiconductor thermal testing. These systems enable manufacturers to develop semiconductors that reliably perform within specified temperature ranges.
AGNEW-ASSO is committed to providing semiconductor thermal testing solutions that help manufacturers meet the most stringent temperature standards and adhere to industry guidelines. The systems we represent are designed to operate within a wide temperature range, from -80˚C to +225˚C, offering electronic noise-free and moisture-free environments. These advanced thermal testing devices are ideal for analyzing component failures, assessing functionality, and determining product life cycles, ensuring your semiconductors meet the highest performance and reliability standards.
MPI Thermal’s Temperature Forcing Systems
In the production of semiconductor components designed for extreme operating conditions, the assembly and testing phases of integrated circuits (ICs) involve rigorous procedures. These include burn-in processes, thermal cycling under both elevated and sub-zero temperatures, and a range of environmental stress simulations. Once deployed, these electronic components must perform reliably even when subjected to severe environmental stressors.
Both product and test engineers—whether in a lab setting or on the semiconductor manufacturing floor—utilize ThermalAir temperature forcing systems to precisely control device temperatures. These systems deliver localized streams of hot or cold air to the device under test (DUT), enabling thermal evaluation across a wide range of conditions from -55°C up to +125°C.
The ThermalAir TA-5000A system is capable of achieving an extended temperature range from -80°C to +225°C, all without requiring liquid nitrogen (LN2) or carbon dioxide (CO2). These compact, self-contained units are plug-and-play, allowing engineers to conduct accurate thermal testing on semiconductor ICs with ease and flexibility.
Thermal Cycling & Thermal Shock Test
Semiconductor integrated circuit (IC) devices are commonly tested on benchtop setups within both engineering development labs and high-volume production environments.
MPI ThermalAir temperature forcing systems deliver a controlled stream of clean, dry air—heated or cooled—directly onto the component requiring thermal evaluation. These systems are engineered to support a wide array of temperature testing protocols, including thermal cycling, environmental stress screening, rapid temperature transitions, and thermal shock simulation.
Whether for qualification, reliability, or design validation, ThermalAir systems meet critical temperature test demands by enabling precise and repeatable thermal conditioning at the point of use.